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Welcome to Dascanova
Inventor of Dascanova Technology

Dascanova Technology (international patent applications pending) redistributes density inside the particleboard, fiberboard, or insulation boards before or during compression.

This leads to a higher concentration of particles in the areas subjected to compression and less concentration of particles in the remaining areas. The result is improved mechanical properties compared to standard wood-based panels with only horizontal density profile. Thanks to Dascanova Technology wood-based panel producers can save up to 30% on raw materials (wood particles, resin and other chemical components) as well as save on the energy required for production processes e.g. fiber drying.

dascanova 3d board

Dascanova is being supported by the following companies and organizations:

Louisiana State University, Baton Rouge, LA, USAUniversity of Natural Resources and Life Sciences, Vienna, AustriaTechnical University in Zvolen, SlovakiaSwiss Federal Institute of Technology Zurich, SwitzerlandDynea Austria GmbH, Krems, AustriaKronospan Schweiz AG, SwitzerlandAustrian Research Promotion Agency, Vienna, AustriaTech2b, Linz, AustriaFederal Ministry of Economics, Family and Youth, AustriaAustria Wirtschaftsservice GmbH, Vienna, Austria