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Welcome to Dascanova
Inventor of Dascanova Technology
Dascanova Technology (international patent applications pending) redistributes density inside the particleboard, fiberboard, or insulation boards before or during compression.
This leads to a higher concentration of particles in the areas subjected to compression and less concentration of particles in the remaining areas. The result is improved mechanical properties compared to standard wood-based panels with only horizontal density profile. Thanks to Dascanova Technology wood-based panel producers can save up to 30% on raw materials (wood particles, resin and other chemical components) as well as save on the energy required for production processes e.g. fiber drying.